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Mo
Z 42 · ATOMIC MASS 95.95

Molybdenum & Moly Alloys

High-temperature structural refractory.   Spherical Mo, TZM (Mo-Ti-Zr-C), and MHC (Mo-Hf-C) powder for LPBF, DED, and PM-HIP. Applications from rocket-nozzle throats to semiconductor components.

Program Intake Program Tiers
Grades
Pure Mo · TZM · MHC · Mo-Re
Purity
99.95% (pure) · alloyed
PSD cuts
15–45 · 20–63 · 45–106 μm
Process
PA · Plasma-densified
Lead time
4 weeks standard
Traceability
Mill → atomizer → lot
01METALLURGY

Molybdenum retains structural strength above 1600°C, has a lower thermal-expansion coefficient than most refractory metals, and machines more readily than tungsten. It is the working metal for rocket-nozzle throats, glass-melt electrodes, X-ray anodes, and high-temperature sputter targets.

Global Mo production is concentrated in Chile, China, and the U.S. (Climax, Henderson). We hold spherical Mo and TZM stock from U.S. mill and atomizer sources. TZM (0.5% Ti, 0.08% Zr, ~0.02% C) offers 2–3× higher recrystallization temperature than pure Mo.

02SPECIFICATION
Chemistry — Pure Mo 99.95%
ASTM B387 · AMS 7801
Chemistry — TZM
ASTM B387 Type 364 · Ti 0.40–0.55%, Zr 0.06–0.12%, C 0.010–0.040%
Chemistry — MHC
Hf 1.0–1.3%, C 0.05–0.12%, balance Mo
Oxygen
≤ 500 ppm
Carbon (pure Mo)
≤ 30 ppm
Morphology
Spherical (plasma-densified)
Apparent density
Reported per lot COA under program qualification
Hall flow
Reported per lot COA under program qualification
PSD (LPBF)
Reported per lot COA under program qualification
Recryst. temp — Pure Mo
~ 1100°C
Recryst. temp — TZM
~ 1400°C
Traceability
Mill heat → reduction lot → atomization lot → PO
03GRADES & ALLOYS
Pure Mo 99.95%
General high-temperature applications. AMS 7801.
TZM
Titanium-zirconium-molybdenum. Elevated recrystallization temperature.
MHC
Molybdenum-hafnium-carbide. Superior high-temp creep resistance vs TZM.
Mo-30W
For applications requiring intermediate density and temperature capability.
Mo-41Re
Molybdenum-rhenium. Ductile at low temperature, high strength at high T.
Mo-Cu 15/85 · 20/80
Thermal-management heat spreaders for electronics.
04PROCESSING ROUTES
LPBF
Requires preheat > 400°C. Argon atmosphere, O₂ < 300 ppm.
EBM
Vacuum process well-suited to Mo. Available on program qualification.
DED
Coarser PSD (45–150 μm). Higher deposition rates.
Press & sinter
Standard PM route. 1900–2100°C H₂ atmosphere.
Binder jet
Available for complex Mo/TZM geometries.
HIP
Post-consolidation for near-theoretical density.
05APPLICATIONS
Aerospace
Rocket Nozzles
Pure Mo and TZM for solid-rocket motor throat inserts.
Semiconductor
Sputter Targets
High-purity Mo for backend metallization and TFT displays.
Energy
Glass Melt Electrodes
Pure Mo electrodes for float-glass and fiberglass melting.
Medical
X-Ray Anodes
Rotating anodes for diagnostic imaging systems.
Defense
Missile Structural
Nose cones, control-vane bearings, high-temp structural parts.
Industrial
Furnace Hardware
Heating elements, radiation shields, boat and crucible support.
06QUALITY CONTROL
Chemistry
LECO (O/N/C) · ICP-OES for alloying elements · GDMS for trace impurities
PSD
Laser diffraction per ASTM B822
Morphology
SEM per lot
Density
Apparent (B212), tap (B527)
Grain structure
Optical metallography on sintered pucks per lot on request
Recrystallization
DSC on request for TZM/MHC verification
Every lot ships with a mill-certified Certificate of Conformance (CofC) documenting chemistry, PSD, morphology, flow, and traceability from mill heat through atomization to PO. Retained samples are held per lot for program-life duration.

Move it to a
program.

MPS-1 qualification, MPS-2 production, or MPS-3 strategic supply. 4-week standard lead time on qualified stock.

Program Intake Compare Program Tiers